Qualcomm Snapdragon 860 Mobile Platform Firmware vulnerabilities

8 CVEs affecting Qualcomm Snapdragon 860 Mobile Platform Firmware, 0 known to be exploited (CISA KEV), with EPSS scores. Latest: CVE-2024-33056, published 2024-12-02.

Highest priority

Known exploited (CISA KEV) first, then by EPSS exploit probability.

CVE-2023-28559, published 2023-09-05. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption in WLAN FW while processing command parameters from untrusted WMI payload.
CVE-2023-28558, published 2023-09-05. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption in WLAN handler while processing PhyID in Tx status handler.
CVE-2023-28557, published 2023-09-05. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption in WLAN HAL while processing command parameters from untrusted WMI payload.
CVE-2024-33044, published 2024-12-02. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption while Configuring the SMR/S2CR register in Bypass mode.
CVE-2024-33056, published 2024-12-02. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption when allocating and accessing an entry in an SMEM partition continuously.
CVE-2024-33027, published 2024-08-05. High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days. Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
CVE-2024-23357, published 2024-08-05. Medium severity, CVSS 5.5. EPSS: 0.1% chance of exploitation in the next 30 days. Transient DOS while importing a PKCS#8-encoded RSA key with zero bytes modulus.
CVE-2024-33043, published 2024-09-02. Medium severity, CVSS 5.5. EPSS: 0.1% chance of exploitation in the next 30 days. Transient DOS while handling PS event when Program Service name length offset value is set to 255.