CVE-2023-21671: Qualcomm Fastconnect 6700 Firmware

High severity, CVSS 7.8. EPSS: 0.1% chance of exploitation in the next 30 days.

Memory Corruption in Core during syscall for Sectools Fuse comparison feature.

Affected products

• Qualcomm Fastconnect 6700 Firmware: affected versions not specified
• Qualcomm Fastconnect 6900 Firmware: affected versions not specified
• Qualcomm QCA6391 Firmware: affected versions not specified
• Qualcomm QCM6490 Firmware: affected versions not specified
• Qualcomm QCS6490 Firmware: affected versions not specified
• Qualcomm QSM8350 Firmware: affected versions not specified
• Qualcomm SD888 Firmware: affected versions not specified
• Qualcomm SM7315 Firmware: affected versions not specified
• Qualcomm SM7325P Firmware: affected versions not specified
• Qualcomm Snapdragon 778g+ 5g Mobile Platform Firmware: affected versions not specified
• Qualcomm Snapdragon 778g 5g Mobile Platform Firmware: affected versions not specified
• Qualcomm Snapdragon 780g 5g Mobile Platform Firmware: affected versions not specified
• Qualcomm Snapdragon 782g Mobile Platform Firmware: affected versions not specified
• Qualcomm Snapdragon 7c+ Gen 3 Compute Firmware: affected versions not specified
• Qualcomm Snapdragon 888+ 5g Mobile Platform Firmware: affected versions not specified
• Qualcomm Snapdragon 888 5g Mobile Platform Firmware: affected versions not specified
• Qualcomm Video Collaboration VC3 Platform Firmware: affected versions not specified
• Qualcomm WCD9370 Firmware: affected versions not specified
• Qualcomm WCD9375 Firmware: affected versions not specified
• Qualcomm WCD9380 Firmware: affected versions not specified
• Qualcomm WCD9385 Firmware: affected versions not specified
• Qualcomm WCN6740 Firmware: affected versions not specified
• Qualcomm WSA8830 Firmware: affected versions not specified
• Qualcomm WSA8835 Firmware: affected versions not specified

Published 2023-11-07. Last modified 2026-06-17.