CVE-2022-25334: Ti Omap l138 Firmware

High severity, CVSS 8.8. EPSS: 0.2% chance of exploitation in the next 30 days.

The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) lacks a bounds check on the signature size field in the SK_LOAD module loading routine, present in mask ROM. A module with a sufficiently large signature field causes a stack overflow, affecting secure kernel data pages. This can be leveraged to obtain arbitrary code execution in secure supervisor context by overwriting a SHA256 function pointer in the secure kernel data area when loading a forged, unsigned SK_LOAD module encrypted with the CEK (obtainable through CVE-2022-25332). This constitutes a full break of the TEE security architecture.

Affected products

• Ti Omap l138 Firmware: affected versions not specified

Published 2023-10-19. Last modified 2026-06-17.