CVE-2018-11277: Qualcomm MSM8909W Firmware
High severity, CVSS 7.8. EPSS: 0.2% chance of exploitation in the next 30 days.
In Snapdragon (Automobile, Mobile, Wear) in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 430, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, the com.qualcomm.embms is a vendor package deployed in the system image which has an inadequate permission level and allows any application installed from Play Store to request this permission at install-time. The system application interfaces with the Radio Interface Layer leading to potential access control issue.
Affected products
- Qualcomm MSM8909W Firmware: affected versions not specified
- Qualcomm MSM8996AU Firmware: affected versions not specified
- Qualcomm SD205 Firmware: affected versions not specified
- Qualcomm SD210 Firmware: affected versions not specified
- Qualcomm SD212 Firmware: affected versions not specified
- Qualcomm SD415 Firmware: affected versions not specified
- Qualcomm SD430 Firmware: affected versions not specified
- Qualcomm SD450 Firmware: affected versions not specified
- Qualcomm SD615 Firmware: affected versions not specified
- Qualcomm SD616 Firmware: affected versions not specified
- Qualcomm SD617 Firmware: affected versions not specified
- Qualcomm SD625 Firmware: affected versions not specified
- Qualcomm SD650 Firmware: affected versions not specified
- Qualcomm SD652 Firmware: affected versions not specified
- Qualcomm SD810 Firmware: affected versions not specified
- Qualcomm SD820 Firmware: affected versions not specified
- Qualcomm SD820A Firmware: affected versions not specified
- Qualcomm SD835 Firmware: affected versions not specified
- Qualcomm SD845 Firmware: affected versions not specified
- Qualcomm SDA660 Firmware: affected versions not specified
Published 2018-09-20. Last modified 2026-06-17.