CVE-2017-18305: Qualcomm MDM9206 Firmware

High severity, CVSS 7.0. EPSS: 0.2% chance of exploitation in the next 30 days.

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

Affected products

• Qualcomm MDM9206 Firmware: affected versions not specified
• Qualcomm MDM9607 Firmware: affected versions not specified
• Qualcomm MDM9650 Firmware: affected versions not specified
• Qualcomm Sd 205 Firmware: affected versions not specified
• Qualcomm Sd 210 Firmware: affected versions not specified
• Qualcomm Sd 212 Firmware: affected versions not specified
• Qualcomm Sd 835 Firmware: affected versions not specified

Published 2018-10-23. Last modified 2026-06-17.